1. The AC input and DC output should have a clear layout distinction. The best way is to be able to isolate each other.
2. The wiring distance between the input terminal and the output terminal (including DC/DC conversion primary and secondary) must be at least 5 mm.
3. The control circuit and the main power circuit should have a clear layout distinction.
4. Try to avoid parallel wiring of high current and high voltage wiring and measurement lines and control lines.
5. Apply copper to the blank board as much as possible.
6. In the wiring connection of high current and high voltage, try to avoid connecting the wires in the space for a long distance, and the interference caused by it is difficult to handle.
7. If the cost allows, multi-layer board wiring can be used, and there is a special auxiliary power layer and ground layer, which will greatly reduce the impact of EMC.
8. The working place is the most susceptible to interference, so try to adopt a large-area copper wiring method.
9. The wiring of the shielded ground cannot form an obvious loop, which will form an antenna effect and easily introduce interference.
10. High-power devices are better able to be laid out in a more regular manner, facilitating the installation of the heat sink and the design of the heat dissipation air duct.
First, the ground line design
1. Correctly choose single point grounding combined with multi-point grounding.
2. Separate the digital circuit from the analog circuit
3. Try to thicken the ground wire
4. Connect the ground wire to a closed loop
Second, electromagnetic compatibility design
1. Choose a reasonable wire width
2. Adopt the correct wiring strategy
The use of equal traces can reduce the wire inductance, but the mutual inductance and distributed capacitance between the wires increase. If the layout allows, it is better to use a well-shaped mesh wiring structure. The specific method is that one side of the printed board is laterally routed, and the other side is longitudinally routed. Metallized holes are then connected at the intersection holes.
In order to suppress the crosstalk between the printed circuit board wires, the long distance equalization should be avoided when designing the wiring, and the distance between the wires and the wires should be as far as possible. The signal wires should not cross the ground wire and the power cable as much as possible. A grounded trace is placed between some signal lines that are very sensitive to interference, which can effectively suppress crosstalk.
Third, decoupling capacitor configuration
In a DC power supply loop, changes in load can cause power supply noise. For example, in a digital circuit, when a circuit transitions from one state to another, a large spike current is generated on the power line to form a transient noise voltage. The configuration of decoupling capacitors can suppress the noise generated by load changes, which is a common practice for the reliability design of printed circuit boards.
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