As the light and thin have become the direction of the development of consumer electronics, it is becoming more and more common to eliminate the materials and processes and to reduce the size of the wafer-level packaging process.
Wafer-level packaging can be divided into fan-in type and fan-out type. If the packaged chip size and product size are the same in the two-dimensional plane, the chip has enough area to put all the I/O interfaces into it. Fan-in type will be used.
If the size of the chip is not enough to put down all the I/O interfaces, a fan-out type is needed. Of course, the general fan-out type also adds active and/or passive devices to form SIP while expanding the area.
Fan-out wafer level packaging process flow:
Wafer Preparation and Cutting – Place Wafers in Dicing Tape, Cut into Units to Prepare Metal Carriers – Clean Carriers and Remove All Contaminants
Laminate Bonding – Stimulates adhesive film by pressure
Reconstitute wafers - Pick and place chips from wafers on metal carriers
Molding – Sealing the carrier with mold compound
Remove the carrier plate – remove the molded reconstruction chip from the carrier plate
Arrangement and rewiring – metallization process I/O interface on RDL
Wafer bumps - bumps formed at the I/O external connections
Cut into individual units - cut the molded plastic body
The fan-out package "core" market, including power management and single-chip applications such as RF transceivers, has maintained a stable growth trend. Fan-out package "high-density" market, including applications such as processors and memory, with a larger amount of input and output data, has huge market potential.
Universal Instruments FuzionSC Mounter with Innova Direct Wafer Feeder
Has the following advantages:
Highest Accuracy (±10 μm), Maximum Speed, Maximum Area Assembly
Supports substrates up to 610 mm x 813 mm
Supports placement position compensation by AOI precision feedback
Software supports the assembly of a large number of chips
Precise material handling and heat stage options
The SECS-GEM system can be used to track the wafer
FuzionSC Mounter Two Series
Innova advantages:
Can be directly imported into flip chips and wafer level bare chips for pickup and placement
Can flip chip, bare die and surface mount processes on the same platform
With single wafer feed (Innova), or 13 wafer feeds (Innova +)
No need for upstream wafer sorting
The best solution for system package application
Supports wafers up to 300mm
Support ink and ink-free wafer array mapping
Supports substrates up to 610mm x813mm
Wafer Dilation Depth: Programmable (Innova +), Fixed by Clamp (Innova)
Can be directly imported into flip chip or flip chip
With wafer tracking
The best solution for new product introduction or mass production
Innova direct wafer feeder parameters
What are the advantages of Explosion-proof Screen Protectors?
What is an Explosion-proof Screen Protector? This is a Soft Film made of imported PET material. It has very good flexibility and can help you solve the problems of tilting, white edges, and not suitable for curved screens. Can closely fit the curved edge of the screen.
The PET Screen Protector is made of imported materials from Korea. It is equipped with a proprietary "self-healing" function that can automatically repair minor scratches on the film. Daily protection measures to prevent accidental knocks and drops. The screen strengthens the screen and reduces the chance of cracking. Broken tempered glass is no longer replaced frequently.
1. Edge coverage: The Explosion-proof Screen Protective Film is made of PET flexible material, which is very suitable for the screen of your device, and 100% provides excellent edge coverage, and there is no gap between the edges of the device
2. High-definition resolution: high-definition display, true display of the original screen color.
3. Original touch experience: The oleophobic coating surface of the screen protector can provide your phone with original texture and perfect touch screen response speed. The Soft Film also has oleophobicity and water resistance, which can prevent unnecessary fingerprints.
4. Self-repairing scratches: The Screen Protection Film with self-repairing function can automatically repair tiny scratches and bubbles within 24 hours.
5. Anti-seismic and explosion-proof: PET material has high strength, flexibility and elasticity, which can fully decompose the impact force and prevent the mobile phone from breaking
Explosion-Proof Matte Protective Film,Matte Explosion-Proof Screen Protector,Anti-Scratch Matte Film,Anti-Impact Matte Film
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