The 2010 global semiconductor industry can be said to be a memorable year. Chen Lanlan, a researcher at the Tuoba Industrial Research Institute, said that in 2010, the global semiconductor industry's annual growth rate will reach 30%, setting a record high in 10 years. However, due to the slowdown in the growth of the PC industry, the global semiconductor industry will only grow by 5% in 2011, and mobile communication products will become an important momentum supporting overall industry growth. It is estimated that the proportion of mobile communication products in total semiconductors will increase from 26% in 2010 to 30% in 2011. The importance of Mobile DRAM and NAND Flash will also increase with the rise of mobile communication products such as smartphones.
As for the foundry and DRAM industry, although it will grow by 40% and 80% respectively in 2010, due to the slow recovery of the global economy and the high base period in 2010, the estimated industrial output value of wafers in 2011 is still only a small margin. The growth of 5.5%; DRAM industry is due to a slight oversupply, will pay a negative growth of 20% of the bad green performance, the Taiwan factory more difficult situation. Topo suggested that Taiwan’s semiconductor companies, in addition to actively developing high-end products, be able to closely observe the needs and dynamics of emerging markets by developing closer to the markets of emerging countries such as the Asia-Pacific region, and toward developing products that combine low-cost and emerging market characteristics (eg, 3 SIM card / 4 SIM card mobile phone chip) development.
DRAM bleak operator plant prospects have potential concerns The overall DRAM revenue growth in 2010 was 80%, which is the best year ever. The profitability and ranking of Korean factories increased. Samsung's total revenue for January to September is 315.4. Billion U.S. dollars (28.39 trillion won), almost equal to Intel’s revenue, but except for Powerchip and Ruijing, revenues from Nanke, ProMOS and Inacore are all lower than expected.
Takuma estimates that the global DRAM revenue in 2011 will be 20% lower than that in 2010, only 32.2 billion U.S. dollars, and ASP will also fall to the low level of 1.2 to 1.4 U.S. dollars per Gb. Only Samsung and other cost-conscious international companies It is possible to make a profit. For a Taiwan plant that still has a high debt ratio, 2011 will be a difficult year. For example, ProMOS, who is not supported by a consortium, has no choice but to look to Elpida or the government for help.
Mobile DRAM Taiwan's layout is soon to begin. On the other hand, in order to meet the demand for mobile computing devices such as smart phones, mobile DRAMs have unique power-saving features. In addition, the pursuit of thin and light mobile phones also brings new challenges to memory, not only low power consumption, but also to achieve maximum capacity in a limited space, only the most advanced process can meet all requirements, so Mobile DRAM is expected to become Leading new forces in high-end processes.
Tuo pointed out that Mobile DRAM not only has the power-saving features, but also the final product type is different from the general memory module. Mobile DRAM usually uses die-bonded NAND Flash for MCP packaging or PoP
(Package-on-Package) package, and then assembled with the Application Processor stack. Whether the bare wafer test or the MCP package must have a complete package, the DRAM industry in Taiwan should cut it in early and develop a complete supply chain to take a place in the Mobile DRAM market.
With the NAND Flash mobile cloud driving growth and the rising trend of mobile cloud computing, mobile devices such as smart phones can provide real-time information such as time, space, video, and audio information to the cloud server in the Data Center for computing. The best result. Mobile DRAM and NAND Flash will play a more important role in the process, so the proportion of the two in the overall memory will gradually increase.
Although NAND Flash is in great demand, due to the fact that major NAND Flash plants have been attacking market share through three methods, including expansion of production capacity, process miniaturization and adoption of some TLC particles, it is expected that there will be a slight oversupply situation in 2011. , but the price is expected to maintain a certain level.
In the SSD segment, Takuma estimates that the adoption of the 2xnm MLC particle unit price in 2011 will be similar to the current Server-class hard disk (US$1/GB), and will continue to extend the service life to the server level with advanced ECC, Wear Leveling, and other technologies. It is expected to significantly increase the SSD usage in the server market. However, due to the large price difference between SSDs and PC/NB hard drives (SSDs cost about US$1/GB, PC/NB hard drives use only US$0.1/GB), the use of SSDs in NB will remain focused on More than 1,500 US dollars in the high-end models.
As for the foundry and DRAM industry, although it will grow by 40% and 80% respectively in 2010, due to the slow recovery of the global economy and the high base period in 2010, the estimated industrial output value of wafers in 2011 is still only a small margin. The growth of 5.5%; DRAM industry is due to a slight oversupply, will pay a negative growth of 20% of the bad green performance, the Taiwan factory more difficult situation. Topo suggested that Taiwan’s semiconductor companies, in addition to actively developing high-end products, be able to closely observe the needs and dynamics of emerging markets by developing closer to the markets of emerging countries such as the Asia-Pacific region, and toward developing products that combine low-cost and emerging market characteristics (eg, 3 SIM card / 4 SIM card mobile phone chip) development.
DRAM bleak operator plant prospects have potential concerns The overall DRAM revenue growth in 2010 was 80%, which is the best year ever. The profitability and ranking of Korean factories increased. Samsung's total revenue for January to September is 315.4. Billion U.S. dollars (28.39 trillion won), almost equal to Intel’s revenue, but except for Powerchip and Ruijing, revenues from Nanke, ProMOS and Inacore are all lower than expected.
Takuma estimates that the global DRAM revenue in 2011 will be 20% lower than that in 2010, only 32.2 billion U.S. dollars, and ASP will also fall to the low level of 1.2 to 1.4 U.S. dollars per Gb. Only Samsung and other cost-conscious international companies It is possible to make a profit. For a Taiwan plant that still has a high debt ratio, 2011 will be a difficult year. For example, ProMOS, who is not supported by a consortium, has no choice but to look to Elpida or the government for help.
Mobile DRAM Taiwan's layout is soon to begin. On the other hand, in order to meet the demand for mobile computing devices such as smart phones, mobile DRAMs have unique power-saving features. In addition, the pursuit of thin and light mobile phones also brings new challenges to memory, not only low power consumption, but also to achieve maximum capacity in a limited space, only the most advanced process can meet all requirements, so Mobile DRAM is expected to become Leading new forces in high-end processes.
Tuo pointed out that Mobile DRAM not only has the power-saving features, but also the final product type is different from the general memory module. Mobile DRAM usually uses die-bonded NAND Flash for MCP packaging or PoP
(Package-on-Package) package, and then assembled with the Application Processor stack. Whether the bare wafer test or the MCP package must have a complete package, the DRAM industry in Taiwan should cut it in early and develop a complete supply chain to take a place in the Mobile DRAM market.
With the NAND Flash mobile cloud driving growth and the rising trend of mobile cloud computing, mobile devices such as smart phones can provide real-time information such as time, space, video, and audio information to the cloud server in the Data Center for computing. The best result. Mobile DRAM and NAND Flash will play a more important role in the process, so the proportion of the two in the overall memory will gradually increase.
Although NAND Flash is in great demand, due to the fact that major NAND Flash plants have been attacking market share through three methods, including expansion of production capacity, process miniaturization and adoption of some TLC particles, it is expected that there will be a slight oversupply situation in 2011. , but the price is expected to maintain a certain level.
In the SSD segment, Takuma estimates that the adoption of the 2xnm MLC particle unit price in 2011 will be similar to the current Server-class hard disk (US$1/GB), and will continue to extend the service life to the server level with advanced ECC, Wear Leveling, and other technologies. It is expected to significantly increase the SSD usage in the server market. However, due to the large price difference between SSDs and PC/NB hard drives (SSDs cost about US$1/GB, PC/NB hard drives use only US$0.1/GB), the use of SSDs in NB will remain focused on More than 1,500 US dollars in the high-end models.
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