[Text / Zhao Hui] With the continuous reduction of LED chips and the continuous improvement of LED performance, product design is developing rapidly, packaging process and structure are constantly changing, packaging production equipment is rapidly changing, COB integrated packaging, EMC packaging, chip scale packaging and flip-chip etc. The impact of new processes and new technologies on the packaging market is also growing.
From the current market reaction, the COB package has the advantages of good heat dissipation and high light output, and the market share continues to increase. The number of companies involved in COB packaging is gradually increasing. Many large packaging companies have been able to achieve mass production, and their investment in technology has increased year by year.
According to GLII statistics, in 2013 China's LED packaging industry reached 47.3 billion yuan, SMD form packaging is still the mainstream, accounting for 51% of the packaging market output value, COB packaging market acceptance is getting higher and higher, COB packaging and integrated packaging accounted for an increase To 21%.
International companies such as Cree, Samsung and Philips Lumileds have increased their efforts in the COB market in the past two years.
"Hongli's COB device has been recognized by downstream application manufacturers, and sales were good last year." Liu Yusheng, executive deputy general manager of Hongli Optoelectronics (300219.SZ), believes that the COB device market will continue to grow in 2014.
Yin Hui, director of the domestic market for COB packaging, said that domestic manufacturers are not losing to international manufacturers in terms of COB. “The COB light effect of the enhanced spectrum photoelectric has been able to reach 110 lm/w or more, and it is also advantageous in terms of cost control and service flexibility.â€
EMC packaging and chip scale packaging, which became popular last year, are also constantly affecting the development of the packaging industry. Domestic packaging manufacturers have also begun to accelerate the R&D productivity in these areas.
According to incomplete statistics, mainstream packaging manufacturers including Shenzhen Smect Optoelectronics, Hongli Optoelectronics, Tiandian Optoelectronics, Jingke Electronics and Jingtai Co., Ltd. all put into production EMC packaging business.
“In fact, EMC packaging and chip-level packaging are one of the next moves for Taiwanese packaging companies. They will become the two mainstream technology trends that affect the changes in the LED packaging industry.†General Manager, Taiwan Everbright Electronics Manufacturing Group Liu Bang said that this is also an important means for Taiwanese companies to counter the mainland packaging enterprises.
"In any case, the decisive factors for the competition of packaging companies in the future will be management capabilities, cost control, scale and brand, etc." Gwan-LED Lighting Summit member company - General Manager of Jingtai Co., Ltd. Gong Wen said that Jingtai is developing every year. The minimum investment in terms of the total turnover is about 5%-8%, mainly to improve product performance and reduce costs.
As the LED lighting terminal market demand enters the rapid release period, the packaging industry will also usher in an unprecedented period. From the first quarterly report released in 2014, the domestic packaged listed companies have basically continued the high growth and high income of last year. the trend of. "With the expansion of the scale of domestic packaging manufacturers, the rapid decline in cost and the continuous improvement of performance, domestic packaging companies will occupy a larger market share in the future." Dr. Zhang Xiaofei said that strengthening the links with upstream and downstream enterprises through mergers and acquisitions Or the strategy alliance and other methods to start developing products with downstream demand will be the focus of the future development of the packaging enterprise.
From the current market reaction, the COB package has the advantages of good heat dissipation and high light output, and the market share continues to increase. The number of companies involved in COB packaging is gradually increasing. Many large packaging companies have been able to achieve mass production, and their investment in technology has increased year by year.
According to GLII statistics, in 2013 China's LED packaging industry reached 47.3 billion yuan, SMD form packaging is still the mainstream, accounting for 51% of the packaging market output value, COB packaging market acceptance is getting higher and higher, COB packaging and integrated packaging accounted for an increase To 21%.
International companies such as Cree, Samsung and Philips Lumileds have increased their efforts in the COB market in the past two years.
"Hongli's COB device has been recognized by downstream application manufacturers, and sales were good last year." Liu Yusheng, executive deputy general manager of Hongli Optoelectronics (300219.SZ), believes that the COB device market will continue to grow in 2014.
Yin Hui, director of the domestic market for COB packaging, said that domestic manufacturers are not losing to international manufacturers in terms of COB. “The COB light effect of the enhanced spectrum photoelectric has been able to reach 110 lm/w or more, and it is also advantageous in terms of cost control and service flexibility.â€
EMC packaging and chip scale packaging, which became popular last year, are also constantly affecting the development of the packaging industry. Domestic packaging manufacturers have also begun to accelerate the R&D productivity in these areas.
According to incomplete statistics, mainstream packaging manufacturers including Shenzhen Smect Optoelectronics, Hongli Optoelectronics, Tiandian Optoelectronics, Jingke Electronics and Jingtai Co., Ltd. all put into production EMC packaging business.
“In fact, EMC packaging and chip-level packaging are one of the next moves for Taiwanese packaging companies. They will become the two mainstream technology trends that affect the changes in the LED packaging industry.†General Manager, Taiwan Everbright Electronics Manufacturing Group Liu Bang said that this is also an important means for Taiwanese companies to counter the mainland packaging enterprises.
"In any case, the decisive factors for the competition of packaging companies in the future will be management capabilities, cost control, scale and brand, etc." Gwan-LED Lighting Summit member company - General Manager of Jingtai Co., Ltd. Gong Wen said that Jingtai is developing every year. The minimum investment in terms of the total turnover is about 5%-8%, mainly to improve product performance and reduce costs.
As the LED lighting terminal market demand enters the rapid release period, the packaging industry will also usher in an unprecedented period. From the first quarterly report released in 2014, the domestic packaged listed companies have basically continued the high growth and high income of last year. the trend of. "With the expansion of the scale of domestic packaging manufacturers, the rapid decline in cost and the continuous improvement of performance, domestic packaging companies will occupy a larger market share in the future." Dr. Zhang Xiaofei said that strengthening the links with upstream and downstream enterprises through mergers and acquisitions Or the strategy alliance and other methods to start developing products with downstream demand will be the focus of the future development of the packaging enterprise.
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