[Text / Long Zonghui] "Epoxy resin gives everyone the impression that it is only used for in-line insertion and not for patching. We have brought a full range of nearly 20 models of modified epoxy resin to change everyone. Inherent thinking." Li Benjie, general manager of Lianlang New Materials, said that Lianlang hopes to set off an epoxy resin counterattack in the field of LED packaging.
At present, there are two main technical development directions for glue. One is from silica gel to epoxy modification, and the other is Li Benjie's lead from Epoxy to silicon modification. He believes that the problem of weather resistance and adhesion of silica gel has caused a lot of trouble for customers, and the overall performance is naturally not comparable to epoxy resin.
According to Li Benjie, the six silicon-modified epoxy adhesives promoted by Lianlang new materials provide customers with leading solutions for LED packaging.
The first one is the revolutionary 15-minute one-time rapid curing of Lianlang new materials. The innovative white LED 9485 for lighting packaging covers a full range of small, medium and high power in the chip package. After reflowing 3 times after 5630 package, the test 2500 hours of zero light decay.
The second is for the outdoor display, through the highest MSL1 (double 85 over 168 hours) certified high water resistance, hot and cold resistant 5189.
The third model is a white light glue 5388 for traditional lighting package with power of 1W and 2000 hours of zero light decay.
The fourth paragraph is the thermal conductivity of 4.0, the general market can only reach 1.2 of the solid crystal glue 4288.
The fifth model is 9288 for COB potting glue of 60W and below. At present, this glue is under stress test, and it is believed that the best quality can be achieved during the exhibition.
The sixth model is 6188 for packaging UV devices. The current production of UV packaged lamps is relatively small but the profit is very good. Few companies around the world can produce package glue for UV wicks. The current performance of this glue has been Fully surpassing Japanese manufacturers, it is very worthwhile for customers to boldly replace imports.
"Our silicon modified alicyclic epoxy resin encapsulant can solve the defects that traditional epoxy resin materials can not be used for medium and high power, and has successfully solved the problems of high temperature resistance, easy embrittlement and cracking, etc. The unique technology is to radiate heat quickly, instead of stupidly resisting high temperatures, so it will surpass the silica gel to achieve medium and high power zero light decay." Li Benjie spent more than three years on innovative products developed by Lianlang new materials. Quality confidence.
In addition, Li Benjie hopes to find a partner who uses silicon-modified epoxy resin raw materials through this exhibition, and hopes to cooperate with the packaging leader enterprise to develop a one-time rapid curing encapsulation process, such as Lianlang has a mature ten-second UV curing. SMD white glue technology, but it is difficult to do comprehensive testing and large-area promotion and application without the supporting packaging technology. However, this technology is extremely valuable for solving the headaches of packaging customers, such as large inventory, complicated process and high rework rate. Said the cost advantage of energy saving. "We hope to find like-minded people and push the epoxy resin against the silica gel," Li Benjie said.
At present, there are two main technical development directions for glue. One is from silica gel to epoxy modification, and the other is Li Benjie's lead from Epoxy to silicon modification. He believes that the problem of weather resistance and adhesion of silica gel has caused a lot of trouble for customers, and the overall performance is naturally not comparable to epoxy resin.
According to Li Benjie, the six silicon-modified epoxy adhesives promoted by Lianlang new materials provide customers with leading solutions for LED packaging.
The first one is the revolutionary 15-minute one-time rapid curing of Lianlang new materials. The innovative white LED 9485 for lighting packaging covers a full range of small, medium and high power in the chip package. After reflowing 3 times after 5630 package, the test 2500 hours of zero light decay.
The second is for the outdoor display, through the highest MSL1 (double 85 over 168 hours) certified high water resistance, hot and cold resistant 5189.
The third model is a white light glue 5388 for traditional lighting package with power of 1W and 2000 hours of zero light decay.
The fourth paragraph is the thermal conductivity of 4.0, the general market can only reach 1.2 of the solid crystal glue 4288.
The fifth model is 9288 for COB potting glue of 60W and below. At present, this glue is under stress test, and it is believed that the best quality can be achieved during the exhibition.
The sixth model is 6188 for packaging UV devices. The current production of UV packaged lamps is relatively small but the profit is very good. Few companies around the world can produce package glue for UV wicks. The current performance of this glue has been Fully surpassing Japanese manufacturers, it is very worthwhile for customers to boldly replace imports.
"Our silicon modified alicyclic epoxy resin encapsulant can solve the defects that traditional epoxy resin materials can not be used for medium and high power, and has successfully solved the problems of high temperature resistance, easy embrittlement and cracking, etc. The unique technology is to radiate heat quickly, instead of stupidly resisting high temperatures, so it will surpass the silica gel to achieve medium and high power zero light decay." Li Benjie spent more than three years on innovative products developed by Lianlang new materials. Quality confidence.
In addition, Li Benjie hopes to find a partner who uses silicon-modified epoxy resin raw materials through this exhibition, and hopes to cooperate with the packaging leader enterprise to develop a one-time rapid curing encapsulation process, such as Lianlang has a mature ten-second UV curing. SMD white glue technology, but it is difficult to do comprehensive testing and large-area promotion and application without the supporting packaging technology. However, this technology is extremely valuable for solving the headaches of packaging customers, such as large inventory, complicated process and high rework rate. Said the cost advantage of energy saving. "We hope to find like-minded people and push the epoxy resin against the silica gel," Li Benjie said.
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