The entire service robot industry is built on three core technology modules: human-computer interaction and recognition module, environment awareness module, and motion control module. Relying on the three modules, the robot has basic hardware: battery module, power module, host, memory, dedicated chip, etc., as well as operating system:
1. Three core technology modules of intelligent robot : perception + interaction + operation control
The entire service robot industry is built on three core technology modules: human-computer interaction and recognition module, environment awareness module, and motion control module. Relying on the three modules, the robot has basic hardware: battery module, power module, host computer, memory, dedicated chip, etc., as well as operating system: ROS, Linux, Android, etc.; hardware and operating system constitute the robot machine, Integrate basic hardware, systems, algorithms, and control components to form a complete robot that meets certain walking and interactive capabilities; on this basis, various basic application developments are formed, based on the robotic operating system development control APP, administrator APP, and each Class application App, etc.; the generated data will have group services, cloud services, big data services, and so on.
The interaction ability, perception ability and exercise ability of the service robot correspond to three modules. The interaction module includes speech recognition, semantic recognition, speech synthesis, image recognition, etc., which is equivalent to the human brain; the sensing module is equivalent to the human eye, ear, nose by means of various sensors, gyroscopes, laser radar, cameras, cameras, etc. , skin, etc.; the control module includes the steering gear, motor, chip, and so on.
Among the various subdivision modules of the service robot, the importance and maturity of the speech module are the highest, the semantic module is the current breakthrough, and the operational module is the least important. The service module's three modules can be further subdivided into voice modules, semantic modules, image modules, sensing modules, operation control modules, and chip modules. The order of importance is: voice module, semantic module, chip module, image module, sensing module, and operation control module. The importance order of maturity is as follows: voice module, image module, operation control module, perception module, semantic module, chip module.
Antenk PLCC connectors Series Sockets are low profile, thin wall sockets designed to convert plastic leaded chips to a thru-hole PCB format on a .100" centerline grid.Antenk's superior precision stamped contact design provides consistent, high retention contacts for all size chips.
PLCC Connectors -PLCCSockets
A PLCC socket is a component that connects a chip carrier to an electronic circuit via surface-mounting or through-hole technology.
Plastic leaded chip carriers (PLCCs) are used in surface-mount technology where electronic circuits are produced, and components need to be mounted or placed directly onto a printed circuit board (PCB). The chip carrier is placed in a PLCC socket, which is either surface-mounted or features through-hole technology. A specialised tool called a PLCC extractor is needed to remove the chip carrier from the PLCC socket.
What are PLCC sockets used for?
PLCC sockets are used in surface-mount device (SMD) and surface-mount technology (SMT) applications. PLCC sockets made of heavy gauge copper alloy are compatible in high shock / high vibration applications. PLCC sockets made of rolled-leaf copper are useful in low-cost computer applications.
Types of PLCC sockets
The two primary categories of PLCC sockets are:
Surface-mount PLCC sockets, which are used in devices sensitive to heat from the reflow process. These allow for component replacement without redesigning or reworking the entire PCB.
Through-hole technology PLCC sockets are necessary when a device requires stand-alone programming with flash drives or memory devices. These are also beneficial for prototyping activities where wire wrapping is required.
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