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National Semiconductor Corporation announced the industry's first audio subsystem with both digital and analog input paths. The Boomer® stereo audio subsystem, model LM4934, is ideal for multimedia phones, smart phones, and VoIP. National's Boomer audio power amplifiers deliver the desired output power with minimal external components.The LM4934 audio subsystem includes built-in audio amplifiers, volume control circuitry, mixers, and power management control circuitry, and uses National's 3D stereo enhancement technology. Due to the new 42-ball micro SMDxt package, it measures only 3.3mm x 3.9mm. Because 3D sound enhancement technology widens the sound field of two closely spaced speakers, mobile phone users can easily listen to clear music using the phone.
The LM4934 has an I2S digital input and three analog inputs, eliminating the need for external digital/analog converters and multiplexers. The LM4934 single-chip audio subsystem includes two amplifiers, a stereo speaker amplifier that provides 500mW of power output per channel (typical) for an 8W load, and a 30mW power output per channel for a 32W load ( A typical stereo headphone amplifier that operates with a single 3.3V power supply. In addition, the chip features a 25mW mono headphone output and a separate output that can drive an external audio device.
With a phase-locked loop on the board, customers can easily choose a suitable clock frequency between 8MHz and 24MHz. This has the advantage of eliminating the need for an external quartz oscillator to save system cost. All of the chip's functions are controlled by 25 separate I2C-compatible registers, so customers can flexibly design input and output lines with a two-wire interface. In addition, the LM4934 chip can transmit stereo and mono input signals using a simple I2C-compatible interface, and mix these signals into a variety of different modes of output.
High-input/output analog chips in National's new micro SMDxt package take up minimal board space when compared to the same pin count. The micro SMDxt package retains the original benefits of National's micro SMD package, and introduces a unique solder ball structure that allows up to 100 solder balls to be lined up between 0.5mm pitch to ensure more reliable performance. Because of this new packaging technology, National Semiconductor eliminates the need for underfill to ensure that portable electronic products meet the reliability requirements of thermal cycling, thermal shock, contact testing, and flex testing.
The LM4934 is available in a standard 42-bump micro SMDxt package and is priced at $3.80 each in 1,000-unit quantities.
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