[Source: Gaogong LED 's " LED Good Products" magazine May issue reporter / He Wei] Although the LED industry is gradually moving towards rationality, the consequences of crazy investment in previous years have not completely dissipated. Excessive production capacity of upstream epitaxial chips has led to continued decline in chip prices. Packaging companies in the middle of the industry are getting worse and worse. The endless price wars have made the high-margin era of the packaging industry go back. Most companies can only maintain normal gross profit levels.
According to statistics from the High-Tech LED Industry Research Institute (GLII), the LED packaging industry in mainland China reached 39.7 billion yuan in 2012, an increase of 24% from the 32 billion yuan in 2011. In 2012, the number of companies involved in LED packaging in mainland China increased from more than 1,700 in 2011 to 1,750. In 2012, more than 200 LED packaging companies were eliminated in China, and more than 250 companies involved in L ED packaging.
In 2012, the financial report data released by several domestic LED packaging listed companies showed that the industry began to enter the era of low gross profit, and the increase in profits did not become a common problem in the current packaging industry. The average annual price drop of white-light packaged devices is more than 30%, which makes packaging companies have to think about whether packaging is the time to change, and the development and introduction of new materials and processes is the key to making changes in packaging companies. Where.
New materials bring new technology
　 In this context, a new form of packaging began to enter the field of vision, namely EMC packaging. It is understood that EMC (Epoxy MoldingCompound) is a highly integrated frame form using the new Epoxy material and etching technology in the packaging of Molding equipment. Due to changes in materials and structures, it has high heat resistance, UV resistance, high integration, high current, and small size. Under the premise that LEDs require high integration, reduced light cost, and high reliability, it was developed with features of the IC industry.
“EMC packaging is not only reflected in the cost reduction, but also in its superior performance.†Gong Wen, general manager of Jingtai Optoelectronics, said that EMC is a technology introduced from semiconductors. Molding method is used to heat Epoxy and etched copper substrates. And the formation of the framework. The etched copper substrate technology makes the EPOXY contact area larger with the copper substrate, and the EPOXY adhesion is stronger, so that the LED package of the EMC package can pass the red ink test, and the EPOXY anti-UV characteristics, so that the EMC packaged device can Easily respond to harsh environments such as outdoor applications and humidity.
The lower EPOXY expansion factor makes high current applications possible. The 3014EMC package is easy to pass through 150mA applications with a power of 0.5W, the 3030EMC package is 450mA, and the power is 1.5W or even higher to 1.8W.
At the high-tech conference held in February last year, Zhang Jiaxian, former technical director of Ruifeng Optoelectronics, also gave a public speech on EMC packaging technology. He said at the meeting that the development of new materials is a matter of great concern to packaging companies. The trend of LEDs has benefited from every generation of packaging materials, from the first generation of PPA pre-plastic frame + resin / mirror to the second generation of ceramic substrate + mirror forming, until now the third generation of high-reflection material pre-packaging The substrate + resin / mirror surface is the current positive EMC material. The third generation of packaged devices can achieve large-scale production, reduce cost, design flexibility, and smaller size design, which is in line with the trend of thin, high integration and small volume of LED products.
Achieve lower lumen costs
　 Looking back at the history of LED technology development, we can see the evolution of LED cost and luminous efficiency. From 1969 to 2009, LED luminous efficiency has been maintained very stable and rapid progress, LED has always been to improve lm / w as the main goal With the improvement of lm/w, LED applications are constantly upgrading, and the market continues to expand. The goal pursued by LEDs has shifted from lm/w to lm/$ in the fifth decade.
According to a survey of the price of LED bulbs that sell 40W grades and 60W grade incandescent lamps in major markets around the world, and to achieve large-scale penetration of LEDs in general lighting, the cost per package of LEDs needs to be reduced by 10 times. . So it can be said that price is the driving force of technological progress, because technology can never match the pressure on the price.
In terms of market competitiveness, the faster lm/$ is reduced, the better, but there are still quite a few thresholds. "The core technology is still on the LED package, although the LED packaging process is now Quite mature, but because of the driving force of price, LED packaging, including materials and so on, need to be revolutionized." Gong Wen said that the process of LED packaging has not changed much in the long term, in fact, the material is very large. One factor, because packaging materials have never revolutionized. However, in the face of diversified applications, LED packaging materials have begun to improve.
"At present, the price of 1W high-power LED chips of mainstream manufacturers is still high. In the short term, the possibility of water-based price reduction of high-power chips is very small. From the perspective of packaging, the price of single devices continues to decline, and space is limited. The road to lowering the price of a chip or reducing the price of a single device to reduce the cost per unit lumen is difficult to go.†Qu Dejiu, vice president of Tiandian Optoelectronics Market, said that it is a feasible way to reduce the cost per unit lumen from the following two aspects:
1. From the chip point of view, it is necessary to increase the current density of a single chip, so that the 1W chip can work at 700 mA or 1000 mA, and the light effect is only slightly reduced.
2, from the packaging point of view, to minimize the size of the device, while reducing the thermal resistance of the entire device, so that a single device supports a larger current, increasing the power of a single device, thereby reducing the overall package cost.
According to Qu Dejiu, EMC can support a wide range of currents from 60 to 700 mA. The medium and high power products between 0.2W and 3W are very advantageous. They can be widely used in backlights of mobile phones, computers, TVs and other display products, and in medium power indoors. In the lighting. "EMC represents the advanced productivity of the future. The ultimate goal of LED technology development is to reduce the cost per unit of lumens. No matter what packaging form and materials are used, the market pays attention to how much money is 100 lumens. The lumens cannot be reduced, and it is destined to be marketed. Eliminated." Qu Dejiu said.
　 Unfinished , please refer to the May issue of Gaogong LED 's " LED Good Products" magazine.
According to statistics from the High-Tech LED Industry Research Institute (GLII), the LED packaging industry in mainland China reached 39.7 billion yuan in 2012, an increase of 24% from the 32 billion yuan in 2011. In 2012, the number of companies involved in LED packaging in mainland China increased from more than 1,700 in 2011 to 1,750. In 2012, more than 200 LED packaging companies were eliminated in China, and more than 250 companies involved in L ED packaging.
In 2012, the financial report data released by several domestic LED packaging listed companies showed that the industry began to enter the era of low gross profit, and the increase in profits did not become a common problem in the current packaging industry. The average annual price drop of white-light packaged devices is more than 30%, which makes packaging companies have to think about whether packaging is the time to change, and the development and introduction of new materials and processes is the key to making changes in packaging companies. Where.
New materials bring new technology
　 In this context, a new form of packaging began to enter the field of vision, namely EMC packaging. It is understood that EMC (Epoxy MoldingCompound) is a highly integrated frame form using the new Epoxy material and etching technology in the packaging of Molding equipment. Due to changes in materials and structures, it has high heat resistance, UV resistance, high integration, high current, and small size. Under the premise that LEDs require high integration, reduced light cost, and high reliability, it was developed with features of the IC industry.
“EMC packaging is not only reflected in the cost reduction, but also in its superior performance.†Gong Wen, general manager of Jingtai Optoelectronics, said that EMC is a technology introduced from semiconductors. Molding method is used to heat Epoxy and etched copper substrates. And the formation of the framework. The etched copper substrate technology makes the EPOXY contact area larger with the copper substrate, and the EPOXY adhesion is stronger, so that the LED package of the EMC package can pass the red ink test, and the EPOXY anti-UV characteristics, so that the EMC packaged device can Easily respond to harsh environments such as outdoor applications and humidity.
The lower EPOXY expansion factor makes high current applications possible. The 3014EMC package is easy to pass through 150mA applications with a power of 0.5W, the 3030EMC package is 450mA, and the power is 1.5W or even higher to 1.8W.
At the high-tech conference held in February last year, Zhang Jiaxian, former technical director of Ruifeng Optoelectronics, also gave a public speech on EMC packaging technology. He said at the meeting that the development of new materials is a matter of great concern to packaging companies. The trend of LEDs has benefited from every generation of packaging materials, from the first generation of PPA pre-plastic frame + resin / mirror to the second generation of ceramic substrate + mirror forming, until now the third generation of high-reflection material pre-packaging The substrate + resin / mirror surface is the current positive EMC material. The third generation of packaged devices can achieve large-scale production, reduce cost, design flexibility, and smaller size design, which is in line with the trend of thin, high integration and small volume of LED products.
Achieve lower lumen costs
　 Looking back at the history of LED technology development, we can see the evolution of LED cost and luminous efficiency. From 1969 to 2009, LED luminous efficiency has been maintained very stable and rapid progress, LED has always been to improve lm / w as the main goal With the improvement of lm/w, LED applications are constantly upgrading, and the market continues to expand. The goal pursued by LEDs has shifted from lm/w to lm/$ in the fifth decade.
According to a survey of the price of LED bulbs that sell 40W grades and 60W grade incandescent lamps in major markets around the world, and to achieve large-scale penetration of LEDs in general lighting, the cost per package of LEDs needs to be reduced by 10 times. . So it can be said that price is the driving force of technological progress, because technology can never match the pressure on the price.
In terms of market competitiveness, the faster lm/$ is reduced, the better, but there are still quite a few thresholds. "The core technology is still on the LED package, although the LED packaging process is now Quite mature, but because of the driving force of price, LED packaging, including materials and so on, need to be revolutionized." Gong Wen said that the process of LED packaging has not changed much in the long term, in fact, the material is very large. One factor, because packaging materials have never revolutionized. However, in the face of diversified applications, LED packaging materials have begun to improve.
"At present, the price of 1W high-power LED chips of mainstream manufacturers is still high. In the short term, the possibility of water-based price reduction of high-power chips is very small. From the perspective of packaging, the price of single devices continues to decline, and space is limited. The road to lowering the price of a chip or reducing the price of a single device to reduce the cost per unit lumen is difficult to go.†Qu Dejiu, vice president of Tiandian Optoelectronics Market, said that it is a feasible way to reduce the cost per unit lumen from the following two aspects:
1. From the chip point of view, it is necessary to increase the current density of a single chip, so that the 1W chip can work at 700 mA or 1000 mA, and the light effect is only slightly reduced.
2, from the packaging point of view, to minimize the size of the device, while reducing the thermal resistance of the entire device, so that a single device supports a larger current, increasing the power of a single device, thereby reducing the overall package cost.
According to Qu Dejiu, EMC can support a wide range of currents from 60 to 700 mA. The medium and high power products between 0.2W and 3W are very advantageous. They can be widely used in backlights of mobile phones, computers, TVs and other display products, and in medium power indoors. In the lighting. "EMC represents the advanced productivity of the future. The ultimate goal of LED technology development is to reduce the cost per unit of lumens. No matter what packaging form and materials are used, the market pays attention to how much money is 100 lumens. The lumens cannot be reduced, and it is destined to be marketed. Eliminated." Qu Dejiu said.
　 Unfinished , please refer to the May issue of Gaogong LED 's " LED Good Products" magazine.
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