[High- tech LED reporter Zhao Hui] With the gradual improvement of domestic packaging technology and technology, and the downstream lighting market put forward higher requirements for devices and even chips, some new technologies and processes are gradually coming to the market, in which no flipping Gold-line chip-scale packaged devices, ie, unpackaged chips, are favored by more and more LED luminaire companies and end-user application companies due to more stable performance, better heat dissipation, more uniform light color distribution, and smaller size.
New technology has always been one of the core driving forces for reducing costs, improving light efficiency and enhancing the competitiveness of enterprises. To a large extent, the upstream chip and midstream packaging technology directly determine the quality of LED lighting products.
Jingke Electronics is the first company in China to apply flip-chip soldering technology to LED chips. As early as 2003, the company has applied for a number of patents for flip chip welding cores in the United States and China.
"Flip-chip, it is not a simple packaging technology, it is actually the chip technology to extend downstream. As long as it is flip-chip, in a sense, it will cover many aspects of the package." Jingke Electronics Xiao Guowei, managing director, said that Jingke Electronics has been in operation for 11 years since its establishment. No LEDs produced in so many years have been formalwear, and they have been flipped for many years.
Compared with the positive chip, the flip-chip solder chip produced by Jingke Electronics has the advantages of low voltage, high brightness, high reliability, high saturation current density, and good heat dissipation. The practice proves that it is easier to realize the ultra-high-power chip-level module and the multi-functional integrated chip light source technology by using the flip-chip welding method, which has great advantages in the yield and performance of the LED chip module. In addition, flip-chip soldering chips can integrate protection circuits on flip-chip substrates, which can significantly improve chip reliability and performance.
At the same time, Jingke Electronics is also the earliest enterprise in China to implement gold-free wire packaging based on flip-chip welding technology. The combination of a chip-scale light source and a flip-chip process enables a true gold-free package that performs better in terms of reliability and high current surge.
Xiao Guowei believes that before 2020, especially before 2017, with the promotion of technology, the price of packaging technology will continue to decline. In the future, enterprises in the middle and upper reaches are forced to do a lot of technical promotion to compress the industry. It is actually its own internal process. When the process chain can no longer be compressed, it compresses the industry chain. Compressing the chain of the industrial chain, the chip process technology began to gradually move toward the packaging market.
The application of unpackaged chips will also bring some significant changes to the technology, cost, supply chain, etc. of the current chip, package and other aspects.
"Flip-chip is actually a gold-free, solid-free plastic package. The most advanced technology of COB is FCOB technology. In-system chips, System-on-chip technology will soon be widely used." Xiao Guowei said that these links The packaging factory can't do it. Many CEOs of packaging companies often call me and say that the packaging will disappear. I said that it will not disappear, but the chip factory really has many opportunities to cover this link.
In 2013, Jingke Electronics launched the “chip-level LED lighting overall solutionâ€, which saved some of the traditional packaging process through the new wafer-level process, which made the final package size of the LED shrink and the performance more stable.
As a new packaging technology product, the flip-chip gold-free chip-level light source has no problems such as non-brightness, flicker, and high light decay caused by gold wire soldering or poor contact. Compared with the traditional packaging process, the package density of the chip-scale light source has increased by 16 times, the package size has been reduced by 80%, and the luminaire design space is larger.
Xiao Guowei believes that in the next few years, LED chip packaging technology, LED chip and white light packaging technology will have integrated evolution and vertical integration of technology in the next few years. These technologies have become a direct influence on the shape, performance indicators, digitization, and intelligence of LED bureau products. The importance of system integration has become increasingly prominent.
The 11th High-tech LED Industry Summit, which will be held on June 10, 2014 at Shangri-La Hotel, Guangzhou (the same period as Guangzhou International Lighting Exhibition), will invite global industry professionals to gather together to discuss the industry situation in 2014. The future trend of the industry.
Among them, in the morning of the conference LED globalization special session, "no gold wire package and white light chip can reconstruct LED supply chain pattern" keynote speech will invite the only one in mainland China to mass-produce high-power flip chip, integrated chip, and Dr. Xiao Guowei, Chairman of Jingke Electronics Co., Ltd., a manufacturer of LED chip-level light source, module light source and light engine, shares the latest technological progress and market opportunities.
New technology has always been one of the core driving forces for reducing costs, improving light efficiency and enhancing the competitiveness of enterprises. To a large extent, the upstream chip and midstream packaging technology directly determine the quality of LED lighting products.
Jingke Electronics is the first company in China to apply flip-chip soldering technology to LED chips. As early as 2003, the company has applied for a number of patents for flip chip welding cores in the United States and China.
"Flip-chip, it is not a simple packaging technology, it is actually the chip technology to extend downstream. As long as it is flip-chip, in a sense, it will cover many aspects of the package." Jingke Electronics Xiao Guowei, managing director, said that Jingke Electronics has been in operation for 11 years since its establishment. No LEDs produced in so many years have been formalwear, and they have been flipped for many years.
Compared with the positive chip, the flip-chip solder chip produced by Jingke Electronics has the advantages of low voltage, high brightness, high reliability, high saturation current density, and good heat dissipation. The practice proves that it is easier to realize the ultra-high-power chip-level module and the multi-functional integrated chip light source technology by using the flip-chip welding method, which has great advantages in the yield and performance of the LED chip module. In addition, flip-chip soldering chips can integrate protection circuits on flip-chip substrates, which can significantly improve chip reliability and performance.
At the same time, Jingke Electronics is also the earliest enterprise in China to implement gold-free wire packaging based on flip-chip welding technology. The combination of a chip-scale light source and a flip-chip process enables a true gold-free package that performs better in terms of reliability and high current surge.
Xiao Guowei believes that before 2020, especially before 2017, with the promotion of technology, the price of packaging technology will continue to decline. In the future, enterprises in the middle and upper reaches are forced to do a lot of technical promotion to compress the industry. It is actually its own internal process. When the process chain can no longer be compressed, it compresses the industry chain. Compressing the chain of the industrial chain, the chip process technology began to gradually move toward the packaging market.
The application of unpackaged chips will also bring some significant changes to the technology, cost, supply chain, etc. of the current chip, package and other aspects.
"Flip-chip is actually a gold-free, solid-free plastic package. The most advanced technology of COB is FCOB technology. In-system chips, System-on-chip technology will soon be widely used." Xiao Guowei said that these links The packaging factory can't do it. Many CEOs of packaging companies often call me and say that the packaging will disappear. I said that it will not disappear, but the chip factory really has many opportunities to cover this link.
In 2013, Jingke Electronics launched the “chip-level LED lighting overall solutionâ€, which saved some of the traditional packaging process through the new wafer-level process, which made the final package size of the LED shrink and the performance more stable.
As a new packaging technology product, the flip-chip gold-free chip-level light source has no problems such as non-brightness, flicker, and high light decay caused by gold wire soldering or poor contact. Compared with the traditional packaging process, the package density of the chip-scale light source has increased by 16 times, the package size has been reduced by 80%, and the luminaire design space is larger.
Xiao Guowei believes that in the next few years, LED chip packaging technology, LED chip and white light packaging technology will have integrated evolution and vertical integration of technology in the next few years. These technologies have become a direct influence on the shape, performance indicators, digitization, and intelligence of LED bureau products. The importance of system integration has become increasingly prominent.
The 11th High-tech LED Industry Summit, which will be held on June 10, 2014 at Shangri-La Hotel, Guangzhou (the same period as Guangzhou International Lighting Exhibition), will invite global industry professionals to gather together to discuss the industry situation in 2014. The future trend of the industry.
Among them, in the morning of the conference LED globalization special session, "no gold wire package and white light chip can reconstruct LED supply chain pattern" keynote speech will invite the only one in mainland China to mass-produce high-power flip chip, integrated chip, and Dr. Xiao Guowei, Chairman of Jingke Electronics Co., Ltd., a manufacturer of LED chip-level light source, module light source and light engine, shares the latest technological progress and market opportunities.
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