The third quarter will be IC packaging and testing climax

China's demand for branded smart phones and white-brand smart phones, with the warming of economic growth, is expected to climb quarter by quarter this year, plus Apple's iPhone 6 may be available at the end of the third quarter, mobile communications chip maker Qualcomm , MediaTek, Broadcom and Germany-based Deutsche Deutsche Telekom, which set up its Asian headquarters in Taipei a year ago, are expected to climb to the top in the second and third quarters of mobile communications chipsets or power management chips. .

In contrast, the release of its chips to the packaging and testing plant for the latter part of the package and test OEM orders, will also be fully pulled up, sealing and testing plant in the second half of the year bearish. Lin Wenbo, the chairman of the first-line Daifen products company, revealed at a recent law meeting that, since the production lines were almost full, the conservative capital expenditure plan that was originally adopted did not rule out the possible increase in the recovery of the economy than expected.

In the first quarter of the month, the company was unable to exceed its expectation of growth in revenue due to the slowdown of Apple's business. In April, the consolidated revenue was 16.716 billion yuan, and the consolidated revenue of packaging and testing materials was 11.677 billion yuan, up 3.1% on a monthly basis and 9.8% year-on-year. . The slowdown in the pull-up of the Group's EMS (Electrical Power) in April was the key to drag the Group's overall revenue growth. However, the major clients TSMC, Qualcomm, etc., released test orders for OEMs, which was stronger in January than in January, allowing the company to forecast its operating performance in the second quarter, giving 11% to 14% of its quarterly growth rate. The expectation, while the gross margin is full of high-end packaging capacity, the test capacity utilization has also climbed more than 5%, is expected to have 3 to 5% growth compared to the previous quarter.

In April, the combined product revenue of the product was 5.62 billion yuan, up 13.2% month-on-year and 3.5% year-on-year, slightly better than the legal person expectation. It is reported that orders from MediaTek and Qualcomm in May and June were exceptionally strong, and order visibility has been Seeing the third quarter, if there are no accidents, the June consolidated revenue will have the opportunity to see a breakthrough of the 6 billion yuan mark.

Although the company’s consolidated revenue for April was 3.11 billion yuan, it was comparable to March and it was 16.8% lower than the same period of last year. However, from May onwards, OEM orders for release testing of standard memory and mobile memory products are expected. After warming up, chairman Cai Yugong may have a growth rate of less than 10% in the second quarter, but he believes that the operation is full of explosive growth in the second half of the year. In the second quarter, although standard RAM orders were slippery, orders from Toshiba and Micron in Mobile DRAM, NAND Flash, etc. were stronger. In addition, Kingston, the largest corporate shareholder, purchased Powerchip P3 Plant, which produced the fastest 20,000 memory per month. 6 May be handed over to Li Cheng Testing and OEM, which is the key to the bullishness of capacity utilization in the second half of the year.

Recently, Shan State, which has received great attention from the outside world, has benefited from the booming demand for small and medium-sized panel and TV panels, driving LCD driver IC shipments to warm up, and the after-tax net profit of RMB 737 million in the first quarter of this year, an increase of 53% year-on-year. With a net profit of 1.22 yuan, it is expected that the second quarter utilization rate will increase by 5-10% from the previous quarter, and that the performance in June and July will have great growth, and the stock price will set a record high.