[91 demolition] is still great? iPhone 6s Plus dismantling

The iPhone 6s Plus released by Apple this year has become the largest and heaviest iPhone ever. The iPhone 6s was disassembled last week. Today, we also disassemble the iPhone 6s Plus to see if it compares with the iPhone 6s. the difference. (Source: ifixit, translation: 91 demolition)

Before dismantling, take a look at the highlights of the iPhone 6s Plus:

Apple A9 processor and M9 assist processor

16, 64, or 128 GB ROM

5.5 inch 1920x1080 pixel (401 PPI) retina screen, 3D Touch

Front 500W HD camera, rear 1200W iSight camera, 4K video recording, optical image stabilization

7000 Series Aluminum Alloy Housing, Lon-X Glass

Supports 802.11a/b/g/n/ac wireless applications, Bluetooth 4.2, NFC, 23 LTE frequency bands

Taptic Engine Feedback Motor

The iPhone 6s Plus rear panel has a large “S” character, and the shell adopts 7000 series aluminum alloy. Professional organizations analyze the composition of this material: 91.17% aluminum, 0.08% iron, 7.64% zinc, and 0.106% tungsten.

Before the dismantling, first come to X-ray perspective.

As with the iPhone 6s, remove the two bottom screws with a screwdriver.

Use the suction cup tool to separate the iPhone 6s Plus front and rear panels.

Unscrew the screws to remove the metal shield that secures the battery cable.

Use a crowbar to pick up the battery cable.

Use a crowbar to remove the three cables connecting the front and rear panels.

The weight of the iPhone 6s Plus front panel is 80g, a full increase of 33% compared to the previous generation of 60g. It can be seen that Apple wants to increase the weight for the 3D Touch.

In contrast to the iPhone 6s, the iPhone 6s Plus's Taptic Engine feedback motor is smaller in size.

Remove the adhesive from the bottom of the battery.

Remove the battery.

The battery capacity is 2750mAh, which is 165mAh less than the previous generation.

We can take down the camera by dialing the cable.

Take a 6s camera and compare it. On the left is a 6s camera and on the right is a Plus camera. The appearance of the two is basically the same, the position of the cable is also the same, but Plus's camera is significantly larger.

Let's take a closer look at Plus, a 1200W camera with optical image stabilization. You can see Plus's added optical image stabilization component from the opening around the lens.

Prepare to remove the motherboard. Unlike the iPhone 6s, Plus has a coaxial cable on the back of the motherboard. Please disassemble it carefully.

Dial the coaxial cable.

You can take the board down now.

Chips on the front of the motherboard:

Red: Apple A9 APL1022 SoC and SK Hynix LPDDR4 RAM H9HKNNNBTUMUMR-NLH

Orange: Qualcomm MDM9635M LTE Cat.6 chip

Yellow: superior TQF6405 power amplifier

Green: Scarlett SKY77812 Power Amplifier

Light blue: Anwara AFEM-8030 power amplifier

Deep Blue: Qualcomm QFE1000 Envelope Tracking IC

Purple: Should be Mei Sheng 6-axis gyroscope and acceleration sensor integrated chip

Chips on the back of the motherboard:

Red: Hynix H230DG8UD1ACS 16 GB NAND Flash

Orange: General Scientific Industrial 339S00043 Wi-Fi Module

Yellow: NXP NFC 66V10

Green: Apple/Dialog 338S00122 Power Management IC

Light Blue: Apple/Cirrus Logic 338S00105 Audio IC

Dark Blue: Qualcomm PMD9635 Power Management IC

Purple: Scarlett SKY77357 Power Amplifier

Red: Murata 240 front-end module

Orange: RF Micro Devices RF5150 Antenna Switch

Yellow: NXP 1610A3

Green: Apple/Cirrus Logic 338S1285 Audio IC

Light blue: Texas Instruments TPS65730A0P power management IC

Dark blue: Qualcomm WTR3925 wireless transceiver chip

Pink: Sijia SKY13701 cellular and GPS receiver filter module

Black: Texas Instruments TI 57A5KXI

Remove the speaker and cable.

The Plus speaker is very similar to the iPhone 6s, except that it has made some simple modifications to the form factor.

Remove the small board and cable, small board integrated Lightning interface components.

Similar to the iPhone 6s, Plus has a microphone at the bottom.

This highly integrated design is more space-saving, but the side effect is that any part of the damage is worse than a whole board.

Finally came a family portrait. All our dismantling was completed. iFixit scored 7 points for the maintenance of iPhone 6s Plus (10 is the easiest to fix), except that the Touch ID and the motherboard are more complex and difficult to repair, the other parts are still easier to repair.

More fresh hot disassemble video, please pay attention to micro signal: jiuyaochai

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