During the 2016 CIOE period, Xinyichang focused on two devices, the GS100BH-PA planar high-speed die bonder and the GS866 fully automatic planar die bonder.
As we all know, Gujing has always been regarded as one of the most important and difficult aspects of packaging technology. Therefore, solid crystal equipment has been monopolized by foreign companies such as ASM for a long time.
In recent years, domestic equipment manufacturers have gradually emerged in the equipment market, and their market share has also been greatly improved. Xinyichang has become a recognized leader in the industry after 18 years of accumulation and precipitation.
“Unlike other domestic manufacturers, we have always positioned ourselves as a high-end product. The performance of the equipment is the focus of our consideration.†Yuan Yibao, deputy general manager of Xinyichang, said that the company now accounts for more than 70% of the domestic solid crystal machine market share. It has grown into a leading company in China's solid crystal machine industry.
GS100BH-PA adopts the international leading double-solid crystal, double-dot, dual-wafer search system, vacuum leak detection, automatic loading and unloading, automatic and automatic replacement of the crystal ring to improve production efficiency, and at the same time, control the equipment operation through the industrial computer, simplify automation How to use the device.
The GS100BH-PA series has a duty cycle of 60ms, which is mainly applicable to SMD (020, 1010, 2121, 3014, 2835, 5050).
Yuan Manbao said, "The demand for patch on the market is still very large. This GS100BH-PA planar high-speed die bonder was born. The products are mainly used in the three directions of display, lighting and backlight. Is stability or price/performance is far better than all other devices."
In addition, the GS866 fully automatic planar solid crystal machine adopts a double-dispensing system driven by a linear motor, and the high-precision linear drive solid crystal tying head. The fully automatic planar die bonder has a production cycle of 250ms (depending on the size of the wafer and the support) and is suitable for CO aluminum substrates (300-1200m long and 50-90mm wide).
"As a equipment manufacturer, we always make a long-term technical reserve to cope with the ever-changing lighting market in the future." Yuan Manbao emphasized that the GS866 fully automatic planar solid crystal machine is one of them. It is mainly used for flip-chip LED as a light source for fluorescent tubes.
Although there is no market at present, this packaging process will become the development direction of the future market.
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Shenzhen GuanChen Electronics Co., Ltd. , https://www.gcneotech.com