In the process workshop of the 3rd China International Medical Electronics Conference (CMET2010) held recently, Dr. Shangguan Dongkai, Senior Vice President of the Technical Department of Flextronics Headquarters, made a wonderful presentation on "Miniature Packaging and Assembly Technology in Medical Electronics" He gave a speech and conducted an interactive discussion with the audience on medical electronics, especially in the field of portable and household medical electronics manufacturing technology.
Product miniaturization technology is already in other products-such as mobile phones and other consumer electronics products-has many years of development and application experience, and related experiments have also been for several years. In the CMET2010 process workshop, Dr. Shangguan Dongkai introduced the application of miniaturization technology in medical devices based on Flextronics' years of experience.
Flextronics' assembly capabilities
There are many microelectronic packaging technologies that can be applied to medical devices. For example, integration includes integrated SoC of semiconductor silicon, system in package, and three-dimensional packaging. And in terms of assembly, there are less than 8 mm, or 0201, 01005 component assembly, three-dimensional assembly, flexible circuit board assembly, etc., these methods can also achieve miniaturization of products at the board level.
Miniaturized packaging and assembly technology available in medical electronics
Specifically, taking the assembly of 0201 and 01005 components as an example, this technology has been used in consumer electronics for five years, but it has not been widely used in medical electronics because it involves micro devices in the process. Relatively high requirements: such as device requirements, PCB board requirements, device flatness, printing process requirements, etc. And need to consider the inspection after design and manufacturing, as well as the final maintenance and so on. Therefore, some work needs to be done before this technology can be applied to medical equipment. 01005 is mainly the application of the module. The basic process is very similar to 0201, but the process must be further refined. For example, in the selection of solder paste, nitrogen may be used during soldering, and rework may be difficult. .
There are many types of Flip Chip, such as Solder Bump can reach 150 microns, there are many things that need to be done to realize the application of Flip Chips in products, what are the requirements of equipment, what are the requirements of technology, etc. Fluxing has a very fine pitch, so it is more difficult to use Flip Chip, and Reflow needs to use nitrogen. Nitrogen does not necessarily require 50 PPIs. Au Stud Bump is used more. In order to further miniaturize, the simplest way is Au Stud Bump.
There are also many discussions on other integration methods, such as SOC and SIP. There are some arguments when to use SOC and when to use SIP. SOC is generally a relatively mature product, mature design, mature market. Because the cost of SOC is high, only batch applications have advantages. SIP is generally used in the application of new technology products, because its cost is relatively low, and the realization is relatively fast, it is more suitable for new products and new technologies.
In addition, some devices can be directly integrated into the silicon chip, everyone is familiar with Die Stacking. We usually have to consider the field of use of silicon chips. If the field is relatively low, overlapping a few together will eventually be a layered consideration. Everyone is also familiar with Package Stacking. For example, Embedded Components in PCB is further miniaturized to increase its function and density. From the aspect of function, especially for high-quality applications, it is desirable that the distance between the PCB and the silicon wafer be as close as possible. There will be some considerations from Embedded Components in PCB and Flip Chip. There are still many discussions and debates on this issue. Because of how much it affects the cost, we will get some advantages from the aspect of miniaturization and product function, but at the same time will have some impact on the manufacturing cost. How to make this decision is not yet clear.
Just now we have been talking about devices and microelectronics. Starting from board-level packaging and assembly, what are the high-density assembly and fine-pitch devices? The fine pitch between devices, what are the important factors to consider. For example, PCB design, PrinTIng, the spacing is getting thinner and denser, how to pull this line out. Another aspect is Pick-place and Reflow in air. Now you have a very dangerous device, and at the same time there is a relatively high and relatively large one. Which one do you put first? These specific things must be optimized.
There are several ways of three-dimensional assembly. One is Package. We use it called in-line. This process was made in Flextronics Laboratory in 2002 and applied to large-scale production in Xixiang factory in 2003. Because at that time the process used is called Package Stacking. What did we do in 2002? In fact, do management and in-line, and complete these two at once. This process was not applied to a larger scale in industry until 2005 or 06. What are the benefits of this? Mainly from the Package Stacking has greater flexibility, can be two management, now almost used in mobile phones. I think it can also be applied to this foundation in the miniaturization of medical devices. What other ways to do three-dimensional assembly? There is a lot of space inside the product that has not yet been used. Now we have to miniaturize and increase the functional density. How can we use more space in the product? The flexible board provides us with such an opportunity.
Picasso once said that all you can imagine is real. In the technical progress of the miniaturized packaging and assembly of flexible circuit boards mentioned above, this sentence can also be understood as: all the products you can imagine Can be produced. It is not enough to produce it alone, and medical equipment needs higher reliability. And miniaturization and high-density packaging have brought many challenges to reliability. Such as electrochemical reliability, thermal reliability, solder joint reliability, dynamic load reliability, etc.
In addition, there are problems with packaging materials and appearance. There are many regulations on environmental protection, so it is necessary to adopt ecological and green technologies, recycled plastics, and biodegradable materials. Taking into account the experience of consumers, more beautiful packaging is also needed.
The last issue to note is DFX, which is manufacturable design. Many of you are designing, and many are manufacturing. How to integrate and cooperate between designing and manufacturing? The answer is through DFX. Now product design is not only a problem for the design team, but also requires the participation of the manufacturing team. But this is not the main challenge. Where is the challenge today? As you know, today is a global environment, the design team may be a design and development center in a certain company and a certain place, but the manufacturing may be a manufacturing plant in another place in another company. The two companies may use How do different systems achieve design and manufacturing cooperation in such an environment? How to optimize the design? This is a subject that industry must face.
Finally, to summarize, technology should be market-oriented. Judging from the market trend, home medical electronic products are developing towards consumer electronics, which may require more wireless connections and links to household appliances. The product replacement must be fast and meet some management requirements. And market requirements. In terms of technology, integration, modularization, high density, miniaturization, and three-dimensionalization are required. Use these technical means to meet market product requirements. In addition, the cooperation of the entire supply chain is needed because we have no time to move from one company to another. Activities such as CMET have greatly promoted the cooperation of the entire industry chain and promoted the entire industry. The cooperation of the supply chain promotes the upgrading of products and the cooperation of design and manufacturing. I hope that through this meeting today, through everyone's research and discussion, we can promote the cooperation of the entire supply chain, and promote the cooperation in design and manufacturing.
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