While doing multi-frequency, how to guarantee the multi-mode integration of 2G/3G/4G on one chip, and pass the authentication of various operators all over the world, this is a great challenge.
Currently, the TD-LTE/TD-SCDMA industry is in full swing, and TD-LTE chip manufacturers are actively launching corresponding solutions for the development of the TD-LTE/TD-SCDMA industry. Judging from the current progress, it is clear that the chip makers are fully prepared.
The market's demand for multi-mode chips is very strong, and through the preparation progress of each chip maker, multi-mode will become the mainstream. In addition, after several rounds of testing, LTE has basically met the demand, and commercial launch is just around the corner. As the LTE core solution matures, the problems in power consumption and interoperability will be effectively solved.
First, multi-mode will be the expansion and interoperability of the mainstream direction from the beginning of the design to the next, and all are closely related to multi-mode.
For LTE terminals to have roaming capabilities in different regions and countries, they need to support multiple communication modes and multiple frequency bands. LTE is very different from 2G and 3G. First, its frequency band is relatively decentralized, and there are more than 40 frequency bands worldwide. In addition, there are technical challenges to cover all LTE frequency bands. Coordinating spectrum resources between different regions and countries requires TD-LTE and even LTE to be widely deployed. LTE chips also need to be adapted to the ever-increasing LTE interoperability requirements.
Through the chip design and development of chip manufacturers, multi-mode will become the mainstream direction in the future. And from the beginning of the design to the post-sequence expansion and interoperability, it should be closely around the multi-mode.
Zhu Xiaoming, technical director of ZTE Microelectronics Research Institute, pointed out: "In the MODEM design of the terminal chip, multi-mode is taken as the most important development requirement for design and development from the very beginning. The MODEM hardware and software design takes into account the multi-mode from the architecture. The requirements for expansion and interoperability: In the design of multi-mode software, a unified multi-mode software architecture is used to define a unified interoperability interaction mode and mechanism among multi-modes, and at the same time, it has scalability to meet the requirements of high efficiency and easy maintenance. In the multi-mode hardware design, multi-mode sharing and multi-mode integration are used in the design of the multi-mode implementation to greatly optimize the area cost and reduce power consumption at the same time, in the multi-mode market strategy, the first to meet the TDD system, and then expand The FDD system strategy is to achieve a certain multi-mode competition strategy in the industry."
The LTE multimode chip introduced by ZTE Microelectronics supports CSFB (CS Fallback) and SR-VCC voice solutions. This is also the 3GPP recommended LTE voice solution. In addition, due to the flexible design of ZTE Microelectronics LTE multimode chip, it can also support the LTE/TD-SCDMA+GSM dual standby solution, and voice can be solved through the GSM mode. Spreadtrum’s first TD-LTE chip, the SC9610, has achieved multi-mode single-chip support for TD-LTE, TD-SCDMA, and GSM three communication standards.
Chuangyi's LTE multi-mode handsets currently support single-card dual-standby voice solutions. That is, one USIM card is used, data services are carried on TD-LTE networks, and voice services are carried on TD-SCDMA/GSM. At the same time, in order to support international and Hong Kong, Macao and Taiwan roaming, LTE modules achieve common mode of TD-LTE and FDD-LTE.
Yan Chenyu, vice president of product marketing for Qualcomm, said: “From the perspective of OEMs using Snapdragon S4, the market demand for multi-mode LTE products should be very strong. Qualcomm’s chips are basically 2G, 3G, and 4G. All formats can be supported on the same chip."
While doing multi-frequency, how to guarantee the multi-mode integration of 2G/3G/4G on one chip, and pass the authentication of various operators all over the world, this is a great challenge.
Second, large-scale commercialization can be realized in the following years. Now, after several rounds of TD-LTE testing, several major chip manufacturers have basically entered the pre-commercial phase.
Now, after several rounds of TD-LTE testing, several chip manufacturers have basically entered the pre-commercial phase. In the future, more communication formats and frequency bands will also be supported. The design and algorithm of the entire chip must also be optimized according to the characteristics of multi-mode. The degree of integration of the chip will be higher, the complexity of the RF chip design and the complexity of the supporting peripheral devices will be higher, and the relevant components will also need to be customized according to actual needs.
Spreadtrum has already met the test requirements for TD-LTE chips. Customers are also developing TD-LTE multi-mode data terminals based on Spreadtrum’s TD-LTE chips, and they are expected to meet the commercial needs of TD-LTE chips next year.
In the TD-LTE test, WarpDrive5000, which is currently undergoing two rounds of testing by Yiyi, is a trial commercial chip. Based on the various types of terminals of the chip, it has been provided to China Mobile for a scale test and even tested in Hangzhou, Shenzhen and Guangzhou. Commercial. At the end of this year, WarpDrive 6000 will be officially commercialized to achieve FDD and TDD common mode.
Qualcomm launched a commercial TDD-LTE chip last year. Taking the 4G LTE service launched in Hong Kong as an example, four mobile phones using Qualcomm Snapdragon S3 and S4 chips all support both TDD and FDD. Qualcomm's current 8960 and 9215 chips also support both TDD-LTE and FDD-LTE, and are backward compatible with 3G/2G.
“The ZTE LTE/TD-SCDMA/GSM multi-mode terminal chip ZX297502 of ZTE Microelectronics has already been shipped on a small scale and has reached the commercial level. The product form includes data cards, CPUs and uFis. The test handset will be launched at the end of this year, and ZTE Microelectronics will Launched LTE/TD-SCDMA/WCDMA/GSM full-mode terminal baseband chips, and integrated LTE single-chip smart phone solutions with APs. These chips will support large-scale shipments of LTE terminals in 2014. Zhu Xiaoming introduced.
Currently, the TD-LTE/TD-SCDMA industry is in full swing, and TD-LTE chip manufacturers are actively launching corresponding solutions for the development of the TD-LTE/TD-SCDMA industry. Judging from the current progress, it is clear that the chip makers are fully prepared.
The market's demand for multi-mode chips is very strong, and through the preparation progress of each chip maker, multi-mode will become the mainstream. In addition, after several rounds of testing, LTE has basically met the demand, and commercial launch is just around the corner. As the LTE core solution matures, the problems in power consumption and interoperability will be effectively solved.
First, multi-mode will be the expansion and interoperability of the mainstream direction from the beginning of the design to the next, and all are closely related to multi-mode.
For LTE terminals to have roaming capabilities in different regions and countries, they need to support multiple communication modes and multiple frequency bands. LTE is very different from 2G and 3G. First, its frequency band is relatively decentralized, and there are more than 40 frequency bands worldwide. In addition, there are technical challenges to cover all LTE frequency bands. Coordinating spectrum resources between different regions and countries requires TD-LTE and even LTE to be widely deployed. LTE chips also need to be adapted to the ever-increasing LTE interoperability requirements.
Through the chip design and development of chip manufacturers, multi-mode will become the mainstream direction in the future. And from the beginning of the design to the post-sequence expansion and interoperability, it should be closely around the multi-mode.
Zhu Xiaoming, technical director of ZTE Microelectronics Research Institute, pointed out: "In the MODEM design of the terminal chip, multi-mode is taken as the most important development requirement for design and development from the very beginning. The MODEM hardware and software design takes into account the multi-mode from the architecture. The requirements for expansion and interoperability: In the design of multi-mode software, a unified multi-mode software architecture is used to define a unified interoperability interaction mode and mechanism among multi-modes, and at the same time, it has scalability to meet the requirements of high efficiency and easy maintenance. In the multi-mode hardware design, multi-mode sharing and multi-mode integration are used in the design of the multi-mode implementation to greatly optimize the area cost and reduce power consumption at the same time, in the multi-mode market strategy, the first to meet the TDD system, and then expand The FDD system strategy is to achieve a certain multi-mode competition strategy in the industry."
The LTE multimode chip introduced by ZTE Microelectronics supports CSFB (CS Fallback) and SR-VCC voice solutions. This is also the 3GPP recommended LTE voice solution. In addition, due to the flexible design of ZTE Microelectronics LTE multimode chip, it can also support the LTE/TD-SCDMA+GSM dual standby solution, and voice can be solved through the GSM mode. Spreadtrum’s first TD-LTE chip, the SC9610, has achieved multi-mode single-chip support for TD-LTE, TD-SCDMA, and GSM three communication standards.
Chuangyi's LTE multi-mode handsets currently support single-card dual-standby voice solutions. That is, one USIM card is used, data services are carried on TD-LTE networks, and voice services are carried on TD-SCDMA/GSM. At the same time, in order to support international and Hong Kong, Macao and Taiwan roaming, LTE modules achieve common mode of TD-LTE and FDD-LTE.
Yan Chenyu, vice president of product marketing for Qualcomm, said: “From the perspective of OEMs using Snapdragon S4, the market demand for multi-mode LTE products should be very strong. Qualcomm’s chips are basically 2G, 3G, and 4G. All formats can be supported on the same chip."
While doing multi-frequency, how to guarantee the multi-mode integration of 2G/3G/4G on one chip, and pass the authentication of various operators all over the world, this is a great challenge.
Second, large-scale commercialization can be realized in the following years. Now, after several rounds of TD-LTE testing, several major chip manufacturers have basically entered the pre-commercial phase.
Now, after several rounds of TD-LTE testing, several chip manufacturers have basically entered the pre-commercial phase. In the future, more communication formats and frequency bands will also be supported. The design and algorithm of the entire chip must also be optimized according to the characteristics of multi-mode. The degree of integration of the chip will be higher, the complexity of the RF chip design and the complexity of the supporting peripheral devices will be higher, and the relevant components will also need to be customized according to actual needs.
Spreadtrum has already met the test requirements for TD-LTE chips. Customers are also developing TD-LTE multi-mode data terminals based on Spreadtrum’s TD-LTE chips, and they are expected to meet the commercial needs of TD-LTE chips next year.
In the TD-LTE test, WarpDrive5000, which is currently undergoing two rounds of testing by Yiyi, is a trial commercial chip. Based on the various types of terminals of the chip, it has been provided to China Mobile for a scale test and even tested in Hangzhou, Shenzhen and Guangzhou. Commercial. At the end of this year, WarpDrive 6000 will be officially commercialized to achieve FDD and TDD common mode.
Qualcomm launched a commercial TDD-LTE chip last year. Taking the 4G LTE service launched in Hong Kong as an example, four mobile phones using Qualcomm Snapdragon S3 and S4 chips all support both TDD and FDD. Qualcomm's current 8960 and 9215 chips also support both TDD-LTE and FDD-LTE, and are backward compatible with 3G/2G.
“The ZTE LTE/TD-SCDMA/GSM multi-mode terminal chip ZX297502 of ZTE Microelectronics has already been shipped on a small scale and has reached the commercial level. The product form includes data cards, CPUs and uFis. The test handset will be launched at the end of this year, and ZTE Microelectronics will Launched LTE/TD-SCDMA/WCDMA/GSM full-mode terminal baseband chips, and integrated LTE single-chip smart phone solutions with APs. These chips will support large-scale shipments of LTE terminals in 2014. Zhu Xiaoming introduced.
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